000 | 00550nam a2200193Ia 4500 | ||
---|---|---|---|
003 | OSt | ||
005 | 20160823142037.0 | ||
008 | 130919s9999 xx 000 0 und d | ||
040 |
_aIISER Bhopal _cVBD |
||
082 | 0 | 0 | _a671.732 D615E |
100 | 1 |
_aDini, Jack W. _913871 |
|
245 | 1 | 0 |
_aElectrodeposition: _bthe materials science of coatings and substrates _cJack W. Dini |
260 |
_aNew York : _bNoyes, _c1993. |
||
300 | _axii, 367 p. | ||
650 | 0 |
_aElectroplating. _913872 |
|
650 | 0 |
_aAdhesion. _913873 |
|
650 | 0 |
_aDiffusion. _913874 |
|
942 |
_cREF _2ddc |
||
999 |
_c756 _d756 |